Modula at CSEAC 2026 Wuxi: Smarter Storage Solutions for Semiconductor Manufacturing

2026-08-20

Exhibit Information

The 14th China Semiconductor Equipment, Core Components, and Materials Exhibition (CSEAC 2026)

Scan the QR code to register

展品信息

Modula Lift

  • Maximum load capacity per tray: up to 990 kg

  • Up to 90 tray cycles per hour

  • Saves up to 90% of floor space

Whether it is spare parts management, or the storage of high‑value chips, core components, and raw materials, the Modula Lift delivers stable and reliable support every step of the way.

Modula – See You in Wuxi!

Visit the Modula booth – where you’ll find not only cutting‑edge technology and products, but also warmth and a few pleasant surprises.

  • Event Dates: August 31 – September 2, 2026
  • Venue: Wuxi Taihu International Expo Center
  • Booth No.: B4‑1010